Electro-Spec Blog

Ever the innovator, Electro-Spec’s engineering team identified a need for a plating process that would enhance the performance of RF connectors. What they developed was the TRI-M3™ finish; this cutting edge process represents a dramatic improvement in plating RF connectors.

The TRI-M3™ process provides high corrosion and tarnish resistance with a shelf life that far exceeds traditional silver plating, and with superior electrical performance to nickel. This plating method overcomes the negative characteristics of silver and nickel plating, while enhancing their positive properties. Silver exhibits excellent electrical properties, but tends to tarnish and break down over time, while nickel exceeds silver regarding longer shelf life and wear characteristics, but exhibits poor intermodulation performance, high permeability, and poor screening effects.

The use of gold plating in the electronics industry has been an ongoing part of the expansion of more complex digital electronics and equipment throughout many industry sectors.  According to BullionStreet, over 320 tons of gold are used each year in the electronics industry.  This includes gold in PCs, mobile phones, tablets and other devices.  The overall use of gold in electronics is via gold plating.  Gold plating is primarily used on contacts for switches, relays, and connectors 

As a pioneer in the plating industry, Electro-Spec constantly strives to improve upon current processes. . One of our recent technological innovations is the use of Self Assembled Molecules (SAMs) over plated surfaces. NanoSHIELD-AU provides  a number of benefits for plated products, including reduced thickness, enhanced contact resistance, diffusion resistance, and corrosion and wear resistance. To date, Electro-Spec is the only metal finishing  company in the world that utilizes this technology.