Electro-Spec Blog

A wide range of devices with numerous applications use precious metal plating. This process, however, can often be expensive and the precious metal is subjected to wear and tear that can eventually cause failures. Electro-Spec’s innovative methods for plating include a technological advancement known as NanoSHIELD-AU.  The NanoSHIELD-AU process allows, for example a gold plated component to have a much thinner deposit without a reduction in functionality.

What is NanoSHIELD-AU?

SAM is an acronym for Self-Assembled Molecules. The NanoSHIELD-AU process employs bi-Functional or multi-functional molecules that offer two or more termination groups with different functionality. Essentially, the NanoSHIELD-AU process uses molecules that offer two levels of protection. The molecules used in the NanoSHIELD-AU method can be attached to metal alloys as well as ceramic, glass, plastics, and more. Right now, NanoSHIELD technology is only being used as a post-plate surface treatment for gold and tri-alloy (Tri-M3). 

Products Finishing magazine names Electro-Spec to the ‘Top Shops” list

CINCINNATI, Ohio – Electro-Spec, Inc. has been named one of the best finishing shops in the U.S., according to an industry benchmarking survey conducted by Products Finishing magazine, a trade publication which has covered the industry since 1938.

Silver plating started as a common way to provide cheaper versions of household items, which were originally made of silver.

At its beginning in the 18th century, this included cutlery, platters, plates and candlesticks among other items. In the 19th century, electroplating arose as a rapid method of finishing mass-produced items. Although the 20th and 21st centuries have seen declines in the use of silver for household wares, this reduction was followed by a rise in the use of silver plating for the electronics industry.

While single-metal plating has been used for many years for a variety of industries, “White Bronze” or tri-metal (Tri-M3) plating is quickly becoming a suitable alternative. White Bronze plating offers superior corrosion resistance, low electrical resistance, non-magnetic properties, and extremely high hardness characteristics. It’s a less expensive approach to using silver and offers definitive health safety advantages compared to nickel. Due to its cost effectiveness and performance White Bronze is rapidly becoming the preferred plating for RF Connectors.

White Bronze centers around an alloy ratio of 55% copper, 30% tin, and 15% zinc. It offers the same bright white finish as plated alloys that contain nickel, silver, or rhodium. It produces smooth, low friction surfaces with non-porous characteristics and is also non-magnetic. White Bronze is ideal for soldering applications as it is lead-free, can be soldered with or without flux, and offers excellent leveling characteristics. The most important factor for tri-metal alloys in electroplating is the ability to control the % alloy mixture to achieve specific performance characteristics and properties. This has resulted in an increase use of White Bronze for the electronics and telecommunications industries and is a significant replacement to traditional tin and copper-tin alloy plating via silver or nickel.

A wide range of devices with numerous applications use precious metal plating. This process, however, can often be expensive and the precious metal is subjected to wear and tear that can eventually cause failures. Electro-Spec’s innovative methods for plating include a technological advancement known as SAM’s.  The SAM’S process allows, for example a gold plated component to have a much thinner deposit without a reduction in functionality.

What is SAM’s?

SAM is an acronym for Self-Assembled Molecules. The SAM’S process employs bi-Functional or multi-functional molecules that offer two or more termination groups with different functionality. Essentially, the SAM’S proces s uses molecules that offer two levels of protection. The molecules used in the SAM'S method can be attached to metal alloys as well as ceramic, glass, plastics, and more. Right now, SAM’S technology is only being used as a post-plate surface treatment for gold, silver and tri-alloy (Tri-M3). 

Ever the innovator, Electro-Spec’s engineering team identified a need for a plating process that would enhance the performance of RF connectors. What they developed was the TRI-M3™ finish; this cutting edge process represents a dramatic improvement in plating RF connectors.

The TRI-M3™ process provides high corrosion and tarnish resistance with a shelf life that far exceeds traditional silver plating, and with superior electrical performance to nickel. This plating method overcomes the negative characteristics of silver and nickel plating, while enhancing their positive properties. Silver exhibits excellent electrical properties, but tends to tarnish and break down over time, while nickel exceeds silver regarding longer shelf life and wear characteristics, but exhibits poor intermodulation performance, high permeability, and poor screening effects.